Dr. Shiladri Chakraborty is an Assistant Professor in the Department of Electrical Engineering at IIT Bombay. His primary area of expertise is power electronics, which is a field of technology that uses electronic (semiconductor-based) switches for the efficient conversion and control of electrical power in applications such as renewable energy systems, transportation electrification, and data centers.
Dr. Chakraborty’s prior research experience in power electronics packaging includes a highly cited journal paper (Y. Park et al., 2022, IEEE TTE) that received the First Prize Paper Award. He currently leads an India-wide faculty team under the Indian Design, Semiconductor, Packaging, Systems program associated with India’s Semiconductor Mission, which is focused on integrated power electronics. He also serves as Principal Investigator for two ANRF MAHA-EV funded SiC power packaging projects, one on heterogeneously integrated multichip 2D power modules and another on PCB embedded half-bridge.
As a Fulbright-Nehru scholar, Dr. Chakraborty is pursuing a transformative approach to the design of advanced power semiconductor packages for next-generation electric vehicle power electronics. The project aims to develop SiC multi-chip power modules with reduced parasitic inductances and capacitances, double-sided cooling and sintering, wire-bondless interconnections, and high-temperature substrates. Following design and simulations at IIT Bombay, the visit to National Lab of the Rockies will be leveraged for fabrication and testing. The work is expected to strengthen domestic capabilities in advanced power packaging, foster global innovations in that field and aid the development of compact, efficient converters for a sustainable future.